MAXPCIe 502
The MAXPCIe 502 carrier board is a high performance, modular multi-protocol PCI-Express solution to your tests and simulation requirements, supporting one or two MAX Technologies mezzanine I/O modules. It is powered by a 800MHz RISC processor and 16MB of shared memory, permitting it to buffer and process communication with the host computer.
The on-board firmware allows scheduling of transmit messages, bridging between protocols, complex label filtering, and triggering of recordings. Received messages are time-tagged with 32-bit or 64-bit sub-microsecond precision, without requiring real-time intervention from the host system. Furthermore, multiple carrier boards can be time-synchronized resulting in unmatched precision in critical real-time applications.
The MAXPCIe 502 is complemented by MAX Technologies’ mezzanine I/O modules available for ARINC 429/561/568/629/708/717, ASYNC RS-232/422/485, CSDB, ASCB, HDLC/SDLC, MIL-STD-1553, Pulse/Frequency generator, Analog and Discrete I/O and more. Moreover, multiple protocols can be implemented and run simultaneously on a single MAXPCIe 502 carrier board and all the data transferred is time-synchronized, even between multiple protocols and multiple boards.
Choice of API
The MAXPCIe 502 carrier board can be controlled with the MX Foundation 4 API. This is the recommended API for a new project.
The MAXPCIe 502 carrier board also support the legacy MX Foundation 3 API. Uses this API for older test bench duplicates
Features
- Multi protocol support ARINC 429/561/568/629/708/717 CSDB, ASCB, MIL-STD-1553, ASYNC RS-232/422/485, HDLC/SDLC and more
- Multi-I/O support: Analog I/O, Discrete I/O, Pulse and Frequency generator and more
- Runs multiple protocols and I/O simultaneously
- Powered by a 800 MHz RISC CPU
- Holds up to two MAX Technologies mezzanine modules
- 16 MB of shared memory, for data transfer buffers
- 32-bit or 64-bit sub-microsecond precision time-tags
- Provides accurate time synchronization between protocols and I/O
- On-board message scheduling, buffering, filtering, and monitoring off-load the host computer
- High channel I/O density
Specifications
Bus type
- PCI-Express x1 Gen1 Standard
Number of mezzanine modules supported
- 2 single or 1 double
Synchronization
- SYNC IN/OUT: Synchronization between multiple boards
- IRIG-B IN/OUT
Physical dimensions
- PCI Express short card
- 98 mm x 162 mm
On-board memory
- 64 MB DRAM
External connector type and location
- 100 I/O lines on two VHDCI 68-pin connectors on front face plate
Environmental
- Standard Operating Temperature: 0°C to 70°C
- Storage Temperature: -55°C to 100°C
- Relative Humidity for operation: 0 to 95% (non-condensing)
Reliability MTBF (MIL-HDBK-217 FN2, 30 °C)
- 241,500 hours
Maximum power consumption (carrier board only without mezzanine modules)
- 5 Watts
Choice of I/O modules
MAX Technologies mezzanine modules covers many avionics databuses and I/O needs including:
Matching cable sets
Standard cables are convenient to connect the module I/Os coming out from the carrier boards to the unit under test. Standard or custom lengths are available for all cables. Browse here to pick the right cables.
ORDERING INFORMATION
MAX-SBC-502E MAXPCIe 502, PCI Express intelligent carrier, 2 module sites, IRIG-B
